One-component addition-curing with high-temperature rapid curing, excellent resistance to high and low temperatures, and good adhesion to most substrates.

Excellent thermal conductivity and electrical insulation, with reliable adhesion after curing.

Extremely low viscosity, good fluidity, insulation and moisture proof, resistance to high and low temperatures. Transparent elastic body (jelly-like), repairable, with good adhesion to most substrates and non-corrosive to substrates.

Extremely low viscosity, good fluidity, insulation and moisture proof, and resistance to high and low temperatures. Transparent elastic body (jelly-like), repairable, with good adhesion to most substrates and non-corrosive to substrates.

Resistance to high and low temperatures, with excellent damping, and shock absorption and insulation properties.

Non-flowing, non-curing, white paste-like substance, with excellent thermal conductivity and electrical insulation, resistance to high and low temperatures, and low volatility.